- Stretchable 3D microelectrode array with microneedles fabricated via scalable wafer-level stud-bump bonding enables minimally destructive, stable, long-term electrophysiological interfacing with organoids.
- 3D microneedle electrodes yield higher signal-to-noise ratio and greater recording stability than 2D or planar 3D electrodes in heart and brain organoids.
- Compatible with quantitative pharmacological profiling, the platform supports precise drug screening and scalable disease modelling due to manufacturable, tissue-compliant interfaces.
Adv Sci (Weinh). 2026 May 20:e75778. doi: 10.1002/advs.75778. Online ahead of print.
ABSTRACT
Real-time, non-destructive monitoring of electrophysiological dynamics of 3D organoids is imperative for advancing disease modeling and high-throughput drug screening. However, obtaining continuous, reliable signals remains difficult due to the destructive nature of penetrating probes and the unreliable contact issue prone to surface recordings. Here, we present a stretchable 3D microelectrode array with microneedles (3D MN-sMEA) fabricated via a scalable wafer-level stud-bump bonding process for minimally destructive and stable monitoring. We achieve high-fidelity, reliable electrophysiological recordings of both human iPSC-derived heart and cerebral models. Compared with 2D and 3D planar microelectrodes, 3D microelectrodes with microneedles achieve a higher signal-to-noise ratio and greater long-term recording stability. Furthermore, quantitative pharmacological profiling validates its ability to enable precise drug screening. By combining scalable manufacturing with flexible, tissue-compliant interfaces, our approach enables stable, minimally invasive, and long-term electrophysiological monitoring of 3D organoids for scalable disease modeling and drug discovery.
PMID:42160020 | DOI:10.1002/advs.75778
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